Triquint Semiconductor Corporation

Integration Associates Incorporated

William McCalpin

Howard Bartlow

Jean-Luc Nauleau

Binh Le

Michael Lincoln

Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a lead frame including a major surface, and a die having including a bond pad. A wire may electrically couple a location of the major surface of the lead frame with the bond pad of the die, the wire being situated such that the wire is substantially unbent from the location of the major surface to an edge of the lead frame.

Package including wires contacting lead frame edge

Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.

Package including proximately-positioned lead frame

The present invention is directed toward a system and apparatus for digitally controlling a bias control signal for at least one transistor. The present invention provides for software writable registers that control the bias control signal. The present invention further provides for the bias control signal to be temperature compensated based upon a temperature signal and a temperature profile stored in software writable registers. The present invention further provides for software control of the initialization and configuration of the bias control signal through stored program control of the values in the software writable registers.

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Boulder, CO, United States of America

William McCalpin