Houfei Chen is a prominent inventor based in Boise, ID (US). He has made significant contributions to the field of circuit board technology, holding a total of 13 patents. His work focuses on improving the efficiency and performance of printed circuit boards (PCBs).

Latest Patents

One of Houfei Chen's latest patents is a method for forming a circuit board via structure for high-speed signaling. This invention comprises an improved method for making a via structure used in PCBs. The via allows for the passage of a signal from one signal plane to another, transgressing the power and ground planes between the signal plane. To minimize electromagnetic disturbance between the power and ground planes, as well as signal loss due to return current and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

Career Highlights

Houfei Chen is currently employed at Micron Technology Incorporated, where he continues to innovate in the field of electronics. His expertise in circuit board design has made him a valuable asset to the company.

Collaborations

Some of his notable coworkers include Shiyou Zhao and Hao Wang, with whom he collaborates on various projects related to circuit board technology.

Conclusion

Houfei Chen's contributions to the field of circuit board technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence advancements in high-speed signaling and PCB design.

Profile summary based on public USPTO records.

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