Hou-an Su

Title: The Innovative Contributions of Hou-an Su

Introduction

Hou-an Su is a notable inventor based in Keelung, Taiwan. He has made significant contributions to the field of technology, particularly with his innovative patent related to circuit board connections. His work exemplifies the intersection of creativity and engineering, showcasing how inventive solutions can enhance existing technologies.

Latest Patents

Hou-an Su holds a patent for a "Connection method for yarn wire and circuit board." This invention outlines a method that includes several steps: providing at least one yarn wire, a back adhesive, and a circuit board. The process involves forming at least one through hole on the circuit board, ensuring specific diameter relations between the through hole and the yarn wire. The method also details how to align and extrude the yarn wire through the hole using a jig, ultimately adhering a fixing back adhesive to the circuit board. This innovative approach has the potential to improve the efficiency and reliability of electronic connections.

Career Highlights

Throughout his career, Hou-an Su has worked with reputable companies, including Makalot Industrial Co., Ltd. and Nextronics Engineering Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various projects that leverage his inventive capabilities.

Collaborations

One of his notable collaborators is Kuan-Wen Chen. Their partnership has likely fostered a creative environment that encourages the development of innovative solutions in their respective fields.

Conclusion

Hou-an Su's contributions to the field of technology through his patent and professional experiences highlight the importance of innovation in advancing electronic connections. His work serves as an inspiration for future inventors aiming to make impactful changes in technology.