The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Oct. 17, 2023
Nextronics Engineering Corp., New Taipei City, TW;
Hou-An Su, Keelung City, TW;
Kuan-Wen Chen, New Taipei City, TW;
NEXTRONICS ENGINEERING CORP., New Taipei City, TW;
MAKALOT INDUSTRIAL CO., LTD., Taipei City, TW;
Abstract
A connection structure includes at least one yarn wire, a back adhesive, and a circuit board. The yarn wire includes a yarn and a metal wire that are helically twisted. The back adhesive is elastic and is in an adhesive gel state when coming in contact with heat. A through hole is formed on the circuit board, and a diameter of the through hole D, a diameter of the yarn wire d, a shrunken diameter of the yarn wire being stretched d, and a jig thickness t of a jig have a relation of: 2d>D>2d+t. During assembly, the yarn wire is aligned with the through hole of the circuit board. A portion of the yarn wire is extruded into and passes through the through hole by using the jig, and the portion of the yarn wire forms a protruding wire segment.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile