The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Oct. 17, 2023
Nextronics Engineering Corp., New Taipei City, TW;
Hou-An Su, Keelung City, TW;
Kuan-Wen Chen, New Taipei City, TW;
NEXTRONICS ENGINEERING CORP., New Taipei City, TW;
MAKALOT INDUSTRIAL CO., LTD., Taipei City, TW;
Abstract
A connection method for a yarn wire and a circuit board includes steps as follows: providing at least one yarn wire, a back adhesive, and a circuit board, at least one through hole is formed on the circuit board, and a diameter D of the through hole, a diameter d of the at least one yarn wire, a shrunken diameter dof the yarn wire being stretched, and a jig thickness t of a jig have a relation of: 2d>D>2d+t; placing the yarn wire on the back adhesive, aligning the yarn wire having the back adhesive with the through hole, and extruding and passing the yarn wire through the through hole by using the jig to penetrate the back adhesive; pulling the jig out along a pulling direction; and adhering a fixing back adhesive to one side of the circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile