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Hormazdyar M Dalal

This inventor holds 45 USPTO granted patents, primarily in Semiconductor Technology. Top assignees: International Business Machines Corporation, Semiconductor Components Industries, LLC. Active years: 1980-2013.

USPTO Granted Patents = 45

% Patents Active = 93.3

Average Co-Inventor Count = 3.8

ph-index = 24

Forward Citations = 2,377(Granted Patents)

Location History:

Wappingers Falls, NY (US) (1980 - 1989)
Milton, NY (US) (1994 - 2003)
LaGrangeville, NY (US) (2004 - 2013)

Company Filing History:

41 out of 166,325

International Business Machines Corporation

patents

4 out of 3,720

Semiconductor Components Industries, LLC

patents

Years Active: 1980-2013

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Areas of Expertise:

Shielded Semiconductor Device

Thick Metal Interconnect

Electromigration Resistance

Multi-Level Electronic Package

Edge Seal

Copper Interconnections

Self-Aligned Insulator

Refractory Metal Conductor

Corrosion-Free Conductors

Direct Chip Attach

Solder Ball

Capacitor Technology

45 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8536685 - Shielded semiconductor device structure (2013-09-17),

2. 8129266 - Method of forming a shielded semiconductor device and structure therefor (2012-03-06),

3. 7947592 - Thick metal interconnect with metal pad caps at selective sites and process for making the same (2011-05-24),

4. 7800239 - Thick metal interconnect with metal pad caps at selective sites and process for making the same (2010-09-21),

5. 7163883 - Edge seal for a semiconductor device (2007-01-16),

6. 6972209 - Stacked via-stud with improved reliability in copper metallurgy (2005-12-06),

7. 6734090 - Method of making an edge seal for a semiconductor device (2004-05-11),

8. 6618267 - Multi-level electronic package and method for making same (2003-09-09),

9. 6597067 - Self-aligned, lateral diffusion barrier in metal lines to eliminate electromigration (2003-07-22),

10. 6348731 - Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same (2002-02-19),

11. 6344234 - Method for forming reflowed solder ball with low melting point metal cap (2002-02-05),

12. 6336262 - Process of forming a capacitor with multi-level interconnection technology (2002-01-08),

13. 6323554 - Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD (2001-11-27),

14. 6294835 - Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof (2001-09-25),

15. 6287954 - Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity (2001-09-11),

Title: The Inventor Hormazdyar M Dalal: Pioneering Innovations in Milton, NY

Introduction: Hormazdyar M Dalal is a distinguished inventor based in Milton, NY, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: Hormazdyar M Dalal holds several patents in cutting-edge technologies, including advancements in renewable energy systems, medical devices, and sustainable materials.

Career Highlights: With a career spanning over two decades, Dalal has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing solutions that push the boundaries of conventional thinking.

Collaborations: Throughout his career, Hormazdyar M Dalal has collaborated with leading research institutions, universities, and companies to bring his inventions to life, fostering a culture of innovation and excellence in the industry.

Conclusion: Hormazdyar M Dalal's relentless pursuit of innovation and his passion for creating impactful solutions have solidified his reputation as a trailblazing inventor in Milton, NY, and beyond.

Profile summary based on public USPTO records.

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