This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hooi San Lam: Innovator in Electronic Systems
Introduction
Hooi San Lam is a notable inventor based in Air Itam, Malaysia. He has made significant contributions to the field of electronic systems, particularly with his innovative patent related to molded interconnect memory on package technology. His work exemplifies the intersection of creativity and engineering in modern technology.
Latest Patents
Hooi San Lam holds a patent for a technology titled "Molded interconnect memory on package." This electronic system features a first substrate with solder bumps, a processor integrated circuit (IC) die, and a companion component that includes additional substrates and solder bumps. The design allows for efficient integration and functionality of electronic components, showcasing his expertise in the field.
Career Highlights
Hooi San Lam is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His role at Intel allows him to work on cutting-edge technologies that shape the future of electronics. His contributions to the company and the industry are noteworthy, as he continues to push the boundaries of innovation.
Collaborations
Throughout his career, Hooi San Lam has collaborated with talented individuals such as Hazwani Jaffar and Poh Boon Khoo. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Hooi San Lam's work in electronic systems and his patent for molded interconnect memory on package technology highlight his innovative spirit and dedication to advancing the field. His contributions at Intel Corporation and collaborations with colleagues further emphasize his impact on the industry.