This inventor holds 1 USPTO granted patent. Top assignee: Asm Technology Singapore Pte Ltd. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Honyu Ng and Semiconductor Wire-Bonding Innovation.
Introduction
Honyu Ng is an inventor associated with Singapore and Asm Technology Singapore Pte Ltd. His patent work concerns wire bonding between a semiconductor die and the substrate on which it is mounted.
Latest Patents
Ng is credited with 1 patent, titled “Method of Bonding Wires.” The invention describes using an ultrasonic transducer to bond wires between a semiconductor die and its substrate. The transducer includes an ultrasonic energy generation device, a vibration-amplifying device, a bonding tool, and a mounting structure. The method performs one wire bond at a first ultrasonic frequency and another at a different frequency.
Career Highlights
Ng’s listed patent reflects work in semiconductor assembly, particularly the use of ultrasonic energy and different operating frequencies in wire-bonding processes. He is associated with Asm Technology Singapore Pte Ltd.
Collaborations
The provided information lists Yam Mo Wong and Siu Wing Or as Ng’s coworkers. It does not specify their roles in the patent or describe particular collaborative projects.
Conclusion
Honyu Ng’s recorded invention addresses a semiconductor wire-bonding method that uses different ultrasonic frequencies, highlighting his contribution to electronics manufacturing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile