The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Sep. 21, 2001
Siu Wing Or, Kowloon, HK;
Honghai Zhu, Singapore, SG;
Yam Mo Wong, Singapore, SG;
Honyu Ng, Singapore, SG;
Abstract
A method of bonding wires between a semiconductor die and a substrate on which the die is mounted includes providing an ultrasonic transducer ( ). The transducer ( ) includes an ultrasonic energy generation device ( ), an ultrasonic vibration amplifying device ( ) coupled at one end ( ) to the ultrasonic energy generation device ( ), a bonding tool ( ) coupled to the opposite end ( ) of the ultrasonic vibration amplifying device ( ), and a mounting structure ( ) located between the ends ( ) of the ultrasonic vibration amplifying device ( ). The method also includes performing a first wire bond by operating the ultrasonic transducer ( ) at a first ultrasonic frequency and performing a second wire bond by operating the ultrasonic transducer ( ) at a second ultrasonic frequency, the second ultrasonic frequency being different from the first ultrasonic frequency.