Company Filing History:
Years Active: 2003-2004
Title: Innovations of Honghai Zhu in Semiconductor Technology
Introduction
Honghai Zhu is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. He holds 2 patents that showcase his innovative approaches in the field. His work primarily focuses on methods that enhance the efficiency and effectiveness of wire bonding processes in semiconductor manufacturing.
Latest Patents
One of his latest patents is titled "Method of bonding wires." This patent describes a method of bonding wires between a semiconductor die and a substrate. The process involves the use of an ultrasonic transducer that includes an ultrasonic energy generation device and a bonding tool. The method allows for performing wire bonds at different ultrasonic frequencies, enhancing the bonding quality. Another significant patent is "Method of and apparatus for monitoring a ball forming process." This invention monitors the ball forming process in a wire bonder by comparing a glow discharge parameter with a reference value to ensure the quality of the formed ball.
Career Highlights
Honghai Zhu is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop innovative solutions in semiconductor technology. His expertise in wire bonding processes has made him a valuable asset to the company.
Collaborations
He has collaborated with notable coworkers, including Yam Mo Wong and Siu Wing Or, contributing to various projects that advance semiconductor manufacturing techniques.
Conclusion
Honghai Zhu's innovative patents and contributions to the semiconductor industry highlight his role as a leading inventor in Singapore. His work continues to influence advancements in technology and manufacturing processes.