Location History:
- Gresham, OR (US) (2004)
- Fremont, CA (US) (2004 - 2007)
- Lake Oswego, OR (US) (2005 - 2010)
Company Filing History:
Years Active: 2004-2010
Title: Hongqiang Lu: Innovator in Copper Interconnect Technology
Introduction
Hongqiang Lu is a prominent inventor based in Lake Oswego, Oregon, known for his significant contributions to the field of interconnect technology. With a total of nine patents to his name, Lu has made substantial advancements in the methods for forming copper interconnects, particularly in microelectronic applications. His innovative approaches have garnered attention in the industry, showcasing his expertise and commitment to refining electronic manufacturing processes.
Latest Patents
Hongqiang Lu's recent patents reflect his focus on improving the reliability and efficiency of copper interconnects. One of his notable inventions involves the formation of copper interconnects with Sn coatings. This method includes creating a trench in a dielectric layer through electroplating copper alongside a metal dopant, resulting in a doped copper layer that undergoes annealing to develop a metal dopant capping coating.
In another significant patent, Lu developed a dual damascene interconnect structure designed to enhance electro-migration lifetimes. This process involves patterning a first dielectric to create a metal line, followed by the addition of a second dielectric that is shaped to form a via. His innovative approach allows for the formation of a cavity, filled with conductive metal during the via creation, which improves the electrical contact between the via and the metal line, leading to more reliable interconnects.
Career Highlights
Throughout his career, Hongqiang Lu has worked with esteemed companies such as LSI Logic Corporation and LSI Corporation, where he has contributed to groundbreaking projects and developments in semiconductor technologies. His experience in these leading firms has been instrumental in his role as an innovator in interconnect technology.
Collaborations
Lu has collaborated with other talented professionals in the field, including Peter Austin Burke and Wilbur G. Catabay. These collaborations have allowed him to leverage diverse expertise, further enhancing the impact of his inventions and extending his influence in the research community.
Conclusion
Hongqiang Lu's work continues to shape the landscape of electronic manufacturing with his innovative patents and collaborations. His dedication to improving copper interconnect technology not only advances the capabilities of electronic devices but also solidifies his position as a key inventor in the industry. As technology evolves, Lu’s contributions will likely remain influential in shaping future advancements.