The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Mar. 07, 2005
Hongqiang LU, Lake Oswego, OR (US);
Byung-sung Kwak, Portland, CA (US);
Wilbur G. Catabay, Saratoga, CA (US);
Hongqiang Lu, Lake Oswego, OR (US);
Byung-Sung Kwak, Portland, CA (US);
Wilbur G. Catabay, Saratoga, CA (US);
LSI Corporation, Milpitas, CA (US);
Abstract
A copper interconnect with a Sn coating is formed in a damascene structure by forming a trench in a dielectric layer. The trench is formed by electroplating copper simultaneously with a metal dopant to form a doped copper layer. The top level of the doped copper layer is reduced to form a planarized surface level with the surface of the first dielectric layer. The doped copper is annealed to drive the metal dopants to form a metal dopant capping coating at the planarized top surface of the doped copper layer.