Seongnam-si, South Korea

Honglae Park


Average Co-Inventor Count = 4.9

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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4 patents (USPTO):Explore Patents

Title: Innovations of Honglae Park in Semiconductor Technology

Introduction

Honglae Park is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on the development of advanced semiconductor devices and their manufacturing methods.

Latest Patents

One of Honglae Park's latest patents involves a semiconductor device and a method of manufacturing the same. This innovative semiconductor device includes a substrate and an isolation layer in a first trench, which defines an active region of the substrate. Additionally, it features a gate structure in a second trench that intersects the active region, along with first and second impurity regions that are spaced apart from each other by the gate structure. The gate structure comprises a gate dielectric layer in the second trench, a first metal layer on the gate dielectric layer, and a gate capping layer on the first metal layer. Notably, the gate dielectric layer includes deuterium and nitrogen in an interface region adjacent to the first metal layer, where deuterium is positively charged.

Career Highlights

Honglae Park is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the advancement of electronic devices.

Collaborations

Throughout his career, Honglae Park has collaborated with esteemed colleagues such as Satoru Yamada and Junsoo Kim. These collaborations have further enriched his research and development efforts in the semiconductor field.

Conclusion

Honglae Park's innovative work in semiconductor technology has led to significant advancements in the industry. His contributions continue to shape the future of electronic devices and manufacturing methods.

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