This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Intel Corporation. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Innovations of Hongjin Jiang in Microelectronic Packaging
Introduction
Hongjin Jiang is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of microelectronic packaging, particularly through his innovative patent related to hybrid solder and filled paste.
Latest Patents
Hongjin Jiang holds a patent for a "Hybrid solder and filled paste in microelectronic packaging." This invention describes a solder ball that may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. The hybrid solder can be used with a solder paste that contains an adhesive and a filler of low-temperature solder particles, with the filler comprising less than 80 weight percent of the paste. The solder balls and paste are designed for soldering packages for microelectronic devices. A package can be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and then attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to create a hybrid solder interconnect. Hongjin Jiang has 1 patent to his name.
Career Highlights
Hongjin Jiang is currently employed at Intel Corporation, where he continues to work on advancements in microelectronic technologies. His expertise in solder materials and microelectronic packaging has positioned him as a valuable asset in the industry.
Collaborations
He has collaborated with notable colleagues, including Arun Kumar C Nallani and Rajen S Sidhu, contributing to various projects and innovations within the field.
Conclusion
Hongjin Jiang's work in hybrid solder and filled paste represents a significant advancement in microelectronic packaging. His contributions are essential for the ongoing development of efficient and reliable microelectronic devices.