The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Mar. 29, 2013
Hongjin Jiang, Chandler, AZ (US);
Arun Kumar C. Nallani, Chandler, AZ (US);
Rajen S. Sidhu, Chandler, AZ (US);
Martha A. Dudek, Chandler, AZ (US);
Weihua Tang, Chanderl, AZ (US);
Hongjin Jiang, Chandler, AZ (US);
Arun Kumar C. Nallani, Chandler, AZ (US);
Rajen S. Sidhu, Chandler, AZ (US);
Martha A. Dudek, Chandler, AZ (US);
Weihua Tang, Chanderl, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.