Portland, OR, United States of America

Honghua H Yang

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2007.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Innovations of Honghua H Yang

Introduction

Honghua H Yang is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of circuit modeling and simulation. His work primarily focuses on logic verification in large systems, which is crucial for the advancement of electronic design automation.

Latest Patents

Honghua H Yang holds a patent for a method of preparing a circuit model for simulation. This innovative approach involves decomposing the circuit model, which contains multiple latches, into a series of extended latch boundary components. The process includes partitioning these components and utilizing a constructive bin-packing heuristic to enhance efficiency. The resulting partitioned circuit model can be compiled and simulated on various computing systems, including uni-processor, multi-processor, or distributed processing environments.

Career Highlights

Honghua H Yang is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing and computing solutions. His expertise in circuit modeling has positioned him as a valuable asset within the organization.

Collaborations

Some of his notable coworkers include Steve W Otto and Manpreet Singh Khaira, who have collaborated with him on various projects within Intel Corporation.

Conclusion

Honghua H Yang's innovative work in circuit modeling and simulation has made a significant impact in the field of electronics. His contributions continue to influence advancements in technology and electronic design automation.

Profile summary based on public USPTO records.
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