Hongbo Lan is a prominent inventor based in Qingdao, China, known for his contributions to the field of materials science and engineering. With a total of 9 patents to his name, Lan has made significant strides in developing innovative manufacturing methods for advanced materials.

Latest Patents

One of his latest patents is titled "Method and system for manufacturing flexible transparent conductive film with embedded metal material." This patent outlines a novel approach that involves sequentially printing metal nanowire grids and metal grids with a large aspect ratio on a substrate using an electric field-driven micro-nano 3D printing method. The process results in a composite conductive electrode, which is then treated to create a conductive film. Another notable patent is the "Method for improving surface quality of alloy micro-area via supersaturated film and use thereof." This method enhances the surface quality of alloy micro-areas through electrochemical machining using a saturated electrolyte.

Career Highlights

Hongbo Lan has worked at several esteemed institutions, including Qingdao University of Technology and Qingdao 5D Intelligent Additive Manufacturing Technology Co., Ltd. His work at these organizations has allowed him to push the boundaries of additive manufacturing and materials engineering.

Collaborations

Throughout his career, Lan has collaborated with notable colleagues such as Xiaoyang Zhu and Quan Xu. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Hongbo Lan's innovative work in the field of flexible transparent conductive films and alloy surface quality improvement showcases his dedication to advancing materials science. His contributions continue to influence the industry and inspire future innovations.

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