Company Filing History:
Years Active: 2017-2018
Title: Innovations of Hongbin Shi in Semiconductor Packaging
Introduction
Hongbin Shi is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work is instrumental in advancing technology in this critical area.
Latest Patents
One of Hongbin Shi's latest patents is a stack-type semiconductor package. This innovative package includes a lower package with a substrate, a semiconductor chip, and a mold layer, along with an upper package that contains its own substrate and semiconductor chip. The design features connection terminals situated between the lower and upper package substrates, which include both outermost and inner connection terminals. Additionally, a first under-fill layer is incorporated between the two package substrates, enhancing the overall functionality of the semiconductor package.
Another notable patent is a method of fabricating a semiconductor package. This method involves providing a lower semiconductor package with a substrate and dummy balls, as well as an upper semiconductor package. The process includes joining the upper and lower dummy balls at a specific temperature to create a solder joint, followed by joining the upper and lower solder balls at a different temperature to form a connection terminal. These patents reflect Hongbin Shi's commitment to improving semiconductor technology.
Career Highlights
Hongbin Shi is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role at Samsung allows him to work on cutting-edge technologies and contribute to the development of innovative semiconductor solutions.
Collaborations
Hongbin collaborates with talented coworkers, including Junho Lee and Kang Joon Lee. Their combined expertise fosters a creative environment that drives innovation in semiconductor packaging.
Conclusion
Hongbin Shi's contributions to semiconductor packaging through his patents and work at Samsung Electronics Co., Ltd. highlight his significant impact on the industry. His innovative approaches continue to shape the future of semiconductor technology.