The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Feb. 03, 2017
Hongbin Shi, Hwaseong-si, KR;
Junho Lee, Suwon-si, KR;
Hongbin Shi, Hwaseong-si, KR;
Junho Lee, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A method of fabricating a semiconductor package includes providing a lower semiconductor package including a lower package substrate, and a lower dummy ball and a lower solder ball on a top surface of the lower package substrate, providing an upper semiconductor package including an upper package substrate, and an upper dummy ball and an upper solder ball on a bottom surface of the upper package substrate, joining the upper dummy ball to the lower dummy ball at a first temperature to form a solder joint, and joining the upper solder ball to the lower solder ball at a second temperature to form a connection terminal.