This inventor holds 3 USPTO granted patents. Top assignee: Jusung Engineering Co., Ltd.. Active years: 2004-2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004-2005
Title: Innovations of Hong-Sik Byun
Introduction
Hong-Sik Byun is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of engineering, particularly in the development of advanced technologies. With a total of 3 patents to his name, Byun continues to push the boundaries of innovation.
Latest Patents
One of his latest patents is an electrostatic chuck designed to prevent an arc. This electrostatic chuck includes a metal plate and a dielectric layer on the metal plate, which features a lift pin hole and an injection hole for cooling gas. The design incorporates a lift pin that moves up and down through the lift pin hole, along with first and second protection insulators on the inner surfaces of the lift pin hole and injection hole, respectively.
Another significant patent is an impedance matching circuit for an inductively coupled plasma source. This circuit consists of a first network that includes a first coil and an RF power supply applying a first voltage to the first coil. Additionally, a second network includes a second coil that is grounded and has a second voltage, which is lower than the first voltage. The circuit also features first and second reactive elements connected to the second coil, with a load connected to the other end portions of these reactive elements, ensuring that the phases at the two end portions of the load differ from each other.
Career Highlights
Hong-Sik Byun is currently employed at Jusung Engineering Co., Ltd., where he applies his expertise in engineering and innovation. His work has contributed to the advancement of technologies in various applications.
Collaborations
Byun has collaborated with several talented individuals in his field, including Gi-Chung Kwon and Sung-Weon Lee. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Hong-Sik Byun is a distinguished inventor whose work in electrostatic chucks and impedance matching circuits showcases his innovative spirit. His contributions to engineering continue to influence the industry and inspire future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile