Hong Li

Title: Innovations by Inventor Hong Li

Introduction

Hong Li is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to integrated circuitry.

Latest Patents

One of his latest patents is titled "Transistor structures having conductive structures along pillars of semiconductor material." This invention includes an assembly with pillars of semiconductor material arranged in rows, featuring conductive structures within gap regions. The design aims to enhance the performance of transistors by incorporating channel regions within the pillars and gates within the conductive structures. Another patent focuses on "Methods of forming integrated assemblies having conductive material along sidewall surfaces of semiconductor pillars." This method outlines a process for creating integrated assemblies with conductive lines and rails, emphasizing the formation of conductive material within gaps between the sidewall surfaces of the rails.

Career Highlights

Hong Li is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to push the boundaries of technology and contribute to advancements in integrated circuits.

Collaborations

Throughout his career, Hong has collaborated with talented individuals such as Sanh D Tang and Erica L Poelstra. These collaborations have fostered a creative environment that encourages innovation and the development of groundbreaking technologies.

Conclusion

Hong Li's contributions to semiconductor technology through his patents and work at Micron Technology Incorporated highlight his role as a key innovator in the field. His inventions continue to influence the development of advanced integrated circuitry.