This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Asm Assembly Automation Limited. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Hon Kam Boris Ng: Innovator in Bonding Technology
Introduction
Hon Kam Boris Ng is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, particularly with his innovative patent that enhances the efficiency of wire bonding processes. His work is recognized for its practical applications in the electronics industry.
Latest Patents
Ng holds a patent for a "Bond head for heavy wire bonder." This bonding apparatus is designed to bond a length of wire effectively. It comprises a first module that is drivable along a linear axis towards and away from a bonding point, and a second module that is slidably mounted to the first module. The apparatus includes a wire cutter mounted to the first module and a bonding tool mounted to the second module. A coupling mechanism is incorporated to lock the second module in a fixed relative position to the first module, allowing for precise control during the bonding process.
Career Highlights
Ng is currently employed at Asm Assembly Automation Limited, where he continues to develop innovative solutions in the field of assembly automation. His expertise in bonding technology has positioned him as a valuable asset to his company and the industry at large.
Collaborations
Throughout his career, Ng has collaborated with talented individuals such as Chi Wah Cheng and Tim Wai Tony Mak. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Hon Kam Boris Ng is a distinguished inventor whose contributions to bonding technology have made a significant impact in the electronics sector. His innovative patent and collaborative efforts highlight his commitment to advancing the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile