The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Nov. 21, 2008
Chi Wah Cheng, New Territories, HK;
Tim Wai Tony Mak, Chai Wan, HK;
Hon Kam Boris NG, New Territories, HK;
Chi Wah Cheng, New Territories, HK;
Tim Wai Tony Mak, Chai Wan, HK;
Hon Kam Boris Ng, New Territories, HK;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding tool is mounted to the second module. A coupling mechanism is operative to lock the second module in fixed relative position to the first module, and to unlock the second module from its fixed relative position to the first module so that the second module is slidable relative to the first module in directions parallel to the linear axis.