Homer B Klonis

Title: Innovations by Homer B Klonis

Introduction

Homer B Klonis is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents is for a "Low capacitance coupling wire bonded semiconductor device." This invention provides a semiconductor device with reduced self and mutual capacitance of bonded wires by coating the wires with a foamed polymer that has a very low dielectric constant. This innovation not only improves performance but also electrically insulates the wires against short-circuiting, cushions them with a low modulus sheath, and protects chip bond pad metallization.

Another significant patent is the "Adhesive-sealed window lid for micromechanical devices." This patent describes an improved spatial light modulator package that includes a spatial light modulator attached to a central region of a substrate, a sealing ring around the central region, a window frame attached to the sealing ring, and a window glued to the window frame. This method of gluing the window to the frame prevents distortion of the glass that can occur with heat bonding and eliminates the need for grinding and polishing the glass window after bonding.

Career Highlights

Homer B Klonis is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His work has had a lasting impact on the semiconductor industry, contributing to advancements that enhance device performance and reliability.

Collaborations

Throughout his career, Klonis has collaborated with notable colleagues, including Robert G McKenna and Michael A Lamson. These collaborations have fostered an environment of innovation and have led to the development of groundbreaking technologies.

Conclusion

Homer B Klonis is a distinguished inventor whose contributions to semiconductor technology have significantly advanced the field. His innovative patents reflect his commitment to improving device performance and reliability.