The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2000
Filed:
Sep. 30, 1997
Homer B Klonis, Dallas, TX (US);
Robert G McKenna, Houston, TX (US);
Don Hyde, Plano, TX (US);
Larry A Harmon, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A gasket sealed integrated circuit package (10) including a top member (12) clamped to a bottom member (18) with a gasket seal ring (26) sealed therebetween. Seal ring (26) encompasses an active portion (30) of an integrated circuit (22) to seal an active portion (30) from the ambient without inducing warp or stress on the circuit (30). The package further includes a glass lid (16) clamped within the package. The integrated circuit (22) preferably comprises a micromechanical device (30) formed on a ceramic substrate (24), such as a DMD type spatial light modulator, but can comprise of other devices as well. The package can be easily disassembled to change out the glass lid (16) or integrated circuit substrate (24) and allows sealing of the substrate (24) without subjecting the integrated circuit die (30) to elevated temperatures. The present invention is especially suited for elongated integrated circuits (30).