Larry A Harmon

Title: Larry A Harmon: Innovator in Integrated Circuit Packaging

Introduction

Larry A Harmon is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of integrated circuit packaging. His innovative designs have paved the way for advancements in technology, particularly in the realm of micromechanical devices.

Latest Patents

Larry A Harmon holds a patent for a gasket sealed integrated circuit package. This invention includes a top member clamped to a bottom member with a gasket seal ring sealed between them. The seal ring encompasses an active portion of an integrated circuit to protect it from the ambient environment without inducing warp or stress. The package also features a glass lid that can be easily disassembled for maintenance or replacement. This design is particularly suited for elongated integrated circuits and allows for sealing without subjecting the integrated circuit die to elevated temperatures. He has 1 patent to his name.

Career Highlights

Larry A Harmon is associated with Texas Instruments Corporation, a leading company in the semiconductor industry. His work there has contributed to the development of advanced technologies that are widely used in various applications.

Collaborations

Throughout his career, Larry has collaborated with notable coworkers such as Homer B Klonis and Don Hyde. These collaborations have fostered innovation and have led to the successful development of new technologies.

Conclusion

Larry A Harmon is a distinguished inventor whose work in integrated circuit packaging has had a lasting impact on the industry. His innovative designs continue to influence the development of advanced electronic devices.