Texas Instruments Corporation

Homer B Klonis

Michael A Lamson

Robert G McKenna

Howard Raeburn Test

Mark A Reed

Ronald A Jascott

Arlene Y Yeh

Larry A Harmon

Don Hyde

A semiconductor device having reduced self and mutual capacitance of bonded wires is provided by coating the wires with a foamed polymer effectively having a very low dielectric constant. Additional benefits are realized by electrically insulating the wires against short-circuiting, by cushioning the wires with a low modulus sheath, and by protecting chip bond pad metallization 

Low capacitance coupling wire bonded semiconductor device

An improved spatial light modulator package comprising a spatial light modulator attached to a central region of a substrate , a sealing ring on said substrate around the central region thereof, a window frame attached to the sealing ring , and a window glued to the window frame . Gluing the window to the window frame avoids distortion of the glass that occurs when the window is heat bonded to the window frame, and avoids having to grind and polish the glass window after it is bonded to the window frame.

Adhesive-sealed window lid for micromechanical devices

A semiconductor device having reduced self and mutual capacitance of bonded wires is provided by coating the wires with a foamed polymer effectively having a very low dielectric constant. Additional benefits are realized by electrically insulating the wires against short-circuiting, by cushioning, the wires with a low modulus sheath, and by protecting chip bond pad metallization.

A flexible plating method by continuously controlling the hydrogen concentration of the plating bath by adding controlled amounts of hydrogen gas. The control of the hydrogen concentration is provided by selected distribution and number of nozzles and size of orifices; and predetermined pressure and duration of hydrogen gas flowing through the nozzles, wherein pressure and duration may be variable with time. The control of the hydrogen concentration is selected to provide a ramp-up phase, needed for a rapid plating start, followed by a saturation phase, for consistent plating stability. With metal layer plating under control, a robust, reliable and low-cost metal structure enabling electrical wire connections to the interconnecting copper metallization of ICs is formed. The structure comprises a layer of barrier metal, preferably nickel, that resists copper diffusion, deposited on the non-oxidized copper surface. The structure further comprises an outermost bondable metal layer, preferably gold, unto which a metal wire is bonded for metallurgical connection.

Nickel plating process having controlled hydrogen concentration

A gasket sealed integrated circuit package (10) including a top member (12) clamped to a bottom member (18) with a gasket seal ring (26) sealed therebetween. Seal ring (26) encompasses an active portion (30) of an integrated circuit (22) to seal an active portion (30) from the ambient without inducing warp or stress on the circuit (30). The package further includes a glass lid (16) clamped within the package. The integrated circuit (22) preferably comprises a micromechanical device (30) formed on a ceramic substrate (24), such as a DMD type spatial light modulator, but can comprise of other devices as well. The package can be easily disassembled to change out the glass lid (16) or integrated circuit substrate (24) and allows sealing of the substrate (24) without subjecting the integrated circuit die (30) to elevated temperatures. The present invention is especially suited for elongated integrated circuits (30).

Gasket sealed integrated circuit package

An electronic device (10) such as that of the micromechanical type having a time-released source of a passivant (20). This source (20) is preferably comprised of an impregnated molecular sieve/binder combination, preferably being a polymer. The passivant may be PFDA. The time-released passivant source continuously over the life of the device reduces any tendency of engaged or contacting elements to stick, adhere, or otherwise resist separation. The present invention finds particular use in spatial light modulators of the DMD type. The molecular sieve/binder can also include getter/desiccant source, such as a non-evaporable getter to remove moisture from the hermetically sealed electronic device.

Growing community of inventors

Dallas, TX, United States of America

Homer B Klonis