Holger Hübner

Title: Holger Hübner: Innovator in Multi-Chip Module Technology

Introduction

Holger Hübner is a notable inventor based in Baldham, Germany. He has made significant contributions to the field of electronics, particularly in the development of multi-chip modules. With a total of 5 patents to his name, Hübner's work has advanced the capabilities of electronic components.

Latest Patents

Hübner's latest patents include a connecting element for a multi-chip module and an electronic component that integrates a housing and substrate. The connecting element is designed to establish an electrical connection between two elements, featuring a carrier and a first electrically conductive connecting structure. This innovative design allows for wireless electrical connections between the elements. His electronic component patent describes a housing and a first substrate with integrated circuits, which are mechanically joined to a second substrate, enhancing the functionality and efficiency of electronic devices.

Career Highlights

Throughout his career, Holger Hübner has worked with prominent companies such as Infineon Technologies AG and Osram GmbH. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the electronics sector.

Collaborations

Hübner has collaborated with talented individuals in his field, including Vaidyanathan Kripesh and Björn Hoxhold. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Holger Hübner's contributions to the field of electronics through his patents and collaborations highlight his role as a key innovator in multi-chip module technology. His work continues to influence the industry and pave the way for future advancements.