The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Aug. 03, 2012
Applicants:
Holger Hübner, Baldham, DE;
Björn Hoxhold, Regensburg, DE;
Axel Kaltenbacher, Mintraching, DE;
Inventors:
Assignee:
OSRAM GmbH, München, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 23/13 (2013.01); H01L 23/14 (2013.01); H01L 24/82 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/821 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/96 (2013.01); H01L 2924/12041 (2013.01);
Abstract
A connecting element can be used for a multi-chip module. The connecting element is provided for establishing an electrical connection between two elements and has a carrier and a first electrically conductive connecting structure on a first main surface of the carrier. The first connecting structure is designed in such a way that the first connecting structure connects the first and second elements to each other. A multi-chip module can have such a connecting element and two elements, wherein the two elements are electrically connected to each other in a wireless manner by the connecting element.