The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Dec. 16, 2002
Hans-jürgen Hacke, München, DE;
Holger Hübner, Baldham, DE;
Axel Königer, München, DE;
Max-gerhard Seitz, München, DE;
Rainer Tilgner, München, DE;
Hans-Jürgen Hacke, München, DE;
Holger Hübner, Baldham, DE;
Axel Königer, München, DE;
Max-Gerhard Seitz, München, DE;
Rainer Tilgner, München, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.