Rainer Tilgner

Title: Rainer Tilgner: Innovator in Semiconductor Technology

Introduction

Rainer Tilgner is a notable inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and apparatuses that enhance the detection and functionality of semiconductor wafers.

Latest Patents

Rainer Tilgner's latest patents include a method and apparatus for detecting a crack in a semiconductor wafer. This invention describes a method that utilizes an electrical device and a connecting pad, which is electrically coupled with the device. The crack is detected by an acoustic detector that is acoustically coupled to the semiconductor wafer while the contacting pad is in contact with a probe. Another significant patent involves an electronic component that includes a housing and a substrate. This invention relates to a first substrate that has at least one integrated circuit and multiple contact surfaces arranged in an arbitrary distribution. A second substrate forms a housing and is mechanically joined to the first substrate, ensuring electrical conductivity through surface-to-surface connections.

Career Highlights

Rainer Tilgner is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to develop and refine his innovative ideas, contributing to advancements in the industry.

Collaborations

Throughout his career, Rainer has collaborated with esteemed colleagues such as Alois Nitsch and Horst Baumeister. These collaborations have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Rainer Tilgner's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of electronic components and semiconductor applications.