Infineon Technologies Ag

Rainer Tilgner

Horst Baumeister

Hans-Jürgen Hacke

Holger Hübner

Alois Nitsch

Thomas Rainer Herzog

Heinz Schauer

Wolfgang Sauert

Axel Königer

Peter Alpern

Max-Gerhard Seitz

A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.

Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck

The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.

Electronic component including a housing and a substrate

An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.

Electronic component having a semiconductor chip

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Munich, Germany

Rainer Tilgner