Santa Clara, CA, United States of America

Hoki Kim

USPTO Granted Patents = 8 

Average Co-Inventor Count = 5.7

ph-index = 4

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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8 patents (USPTO):

Title: Innovator Spotlight: Hoki Kim - Pioneering Multi-Surface Edge Pads for Vertical Mount Packages

Introduction: Hoki Kim is a distinguished inventor based in Santa Clara, California, known for his innovative contributions to semiconductor technology. With a total of 8 patents to his name, Kim's work focuses on advancing the capabilities of vertical surface mount technology, enhancing performance and reliability in electronic devices.

Latest Patents: Among Hoki Kim's latest patents are "Multi-surface edge pads for vertical mount packages and methods of making package stacks" and "Dies-on-package devices and methods therefor." The first patent addresses the need for improved bonding surfaces on substrates used in package stacks. His design incorporates multi-surface edge pads with cutouts that increase surface area for soldering, thereby creating stronger and more reliable connections to motherboards. This innovation not only enhances solder joint integrity but also reduces internal stress compared to conventional methods.

His second recent patent, related to "dies-on-package devices," innovates the method of integrating multiple integrated circuit (IC) dies within a single package. By using conductive lines and a molding layer, Kim's design allows for optimized placement and connectivity of second IC dies, maintaining performance while reducing space requirements.

Career Highlights: Hoki Kim is currently affiliated with Adeia Semiconductor Bonding Technologies Inc., where he continues to push the boundaries of semiconductor packaging technology. With his extensive experience and technical expertise, he has significantly impacted the field, leading projects that combine innovation with practical applications.

Collaborations: Throughout his career, Hoki Kim has collaborated with talented professionals such as Min Tao and Zhuowen Sun, reflecting a commitment to teamwork and shared innovation. These partnerships have fostered a dynamic exchange of ideas, further enhancing the quality and efficacy of their collective work.

Conclusion: Hoki Kim exemplifies the spirit of innovation in the semiconductor industry. With his groundbreaking patents and collaborative efforts, he continues to contribute advancements that will shape the future of electronic packaging technologies. As he forges ahead in his research, the impact of his innovations will undoubtedly resonate within the field for years to come.

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