This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Hoe Ku Jung: Innovator in Printed Circuit Board Technology
Introduction
Hoe Ku Jung is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of printed circuit board (PCB) technology. With a total of 2 patents, his work focuses on innovative manufacturing methods that enhance the efficiency and density of circuit patterns.
Latest Patents
One of Hoe Ku Jung's latest patents is a method of manufacturing a printed circuit board having a landless via hole. This invention provides a technique for creating a PCB without the upper land of a via hole, utilizing a photoresist loaded in the via hole. By forming the circuit pattern using only copper from a copper clad laminate, the width of the circuit is minimized, allowing for the realization of fine circuit patterns. Additionally, the landless via hole structure contributes to a highly dense circuit pattern.
Another notable patent is a method for manufacturing a substrate with a cavity. This method involves forming a barrier around a designated area on a copper foil laminated master, where the cavity is to be created. It includes coating a thermosetting material in the cavity area, laminating a dielectric layer and a copper foil layer, and pressing the layers to form the cavity. This innovative approach enhances the functionality of substrates in electronic applications.
Career Highlights
Hoe Ku Jung is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the electronics sector. His work has been instrumental in advancing PCB manufacturing techniques, making significant impacts on the industry.
Collaborations
Throughout his career, Hoe Ku Jung has collaborated with notable colleagues, including Jung Hyun Park and Myung Sam Kang. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Hoe Ku Jung's contributions to printed circuit board technology exemplify the spirit of innovation in the electronics industry. His patents reflect a commitment to enhancing manufacturing processes and improving circuit design. As he continues his work at Samsung Electro-Mechanics Co., Ltd., his impact on the field is expected to grow.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile