The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Sep. 21, 2006
Hoe Ku Jung, Daejeon, KR;
Myung Sam Kang, Daejeon, KR;
Jung Hyun Park, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method for manufacturing a substrate having a cavity which includes forming a barrier around a predetermined area where the cavity is to be formed on a copper foil laminated master, an internal circuit formed in the copper foil laminated master; coating a thermosetting material in the area where the cavity is to be formed; laminating a dielectric layer and a copper foil layer on the copper foil laminated master, on which the thermosetting material is coated; pressing the laminated dielectric layer and copper foil layer using a press plate, on which a protruded part is formed in an area corresponding to the area where the cavity is to be formed; forming an external circuit pattern in the upper part of the laminated dielectric layer; and dissolving the coated thermosetting material using a solvent and forming the cavity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile