The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Nov. 02, 2006
Myung Sam Kang, Daejeon, KR;
Shuhichi Okabe, Daejeon, KR;
Jung Hyun Park, Chungcheongbuk-do, KR;
Hoe Ku Jung, Daejeon, KR;
Ji Eun Kim, Gyeonggi-do, KR;
Myung Sam Kang, Daejeon, KR;
Shuhichi Okabe, Daejeon, KR;
Jung Hyun Park, Chungcheongbuk-do, KR;
Hoe Ku Jung, Daejeon, KR;
Ji Eun Kim, Gyeonggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
Disclosed is a method of manufacturing a printed circuit board having a landless via hole. Specifically, this invention provides a method of manufacturing a printed circuit board having a landless via hole without the upper land of a via hole using a photoresist (P-LPR) which is loaded in the via hole. Therefore, in this invention, since a circuit pattern is formed using only copper of a copper clad laminate, the width thereof is minimized, thus easily realizing a fine circuit pattern. Further, the landless via hole structure is applied, resulting in a highly dense circuit pattern.