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Chungcheongbuk-do, South Korea

Ho Young Son

USPTO Granted Patents = 16 (Patent Applications = 4)

Average Co-Inventor Count = 1.6

ph-index = 2

Forward Citations = 26(Granted Patents)

Location History:

Cheongju-si, KR (2012 - 2014)
Chungcheongbuk-do, KR (2012 - 2015)
Cheongwon, KR (2017)
Cheongwon-gun Chungcheongbuk-do, KR (2015 - 2018)
Icheon-si Gyeonggi-do, KR (2023)
Icheon-si, KR (2022 - 2024)

Company Filing History:

14 out of 10,980

Hynix Semiconductor Inc.

Years Active: 2012-2025

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12500176 - Semiconductor chip including through electrodes, and semiconductor package including the same (2025-12-16),

2. 12463114 - Semiconductor chip including through electrode, and semiconductor package including the same (2025-11-04),

3. 12327779 - Semiconductor chip including through electrode, and semiconductor package including the same (2025-06-10),

4. 12009308 - Semiconductor chip including through electrodes, and semiconductor package including the same (2024-06-11),

5. 11823982 - Semiconductor chip including through electrode, and semiconductor package including the same (2023-11-21),

6. 11594471 - Semiconductor chip including through electrode, and semiconductor package including the same (2023-02-28),

7. 11502051 - Semiconductor chip including through electrode, and semiconductor package including the same (2022-11-15),

8. 10014278 - Semiconductor chip and stacked semiconductor package having the same (2018-07-03),

9. 9570370 - Multi chip package and method for manufacturing the same (2017-02-14),

10. 9159709 - Semiconductor chip and stacked semiconductor package having the same (2015-10-13),

11. 9040419 - Semiconductor package and method for manufacturing the same (2015-05-26),

12. 8816477 - Semiconductor package having a contamination preventing layer formed in the semiconductor chip (2014-08-26),

13. 8669642 - Semiconductor chip and fabricating method thereof (2014-03-11),

14. 8310045 - Semiconductor package with heat dissipation devices (2012-11-13),

15. 8217434 - Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same (2012-07-10),

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