The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Aug. 15, 2014
Applicant:
SK Hynix Inc., Icheon, KR;
Inventors:
Tac Keun Oh, Seoul, KR;
Jong Hoon Kim, Suwon, KR;
Ho Young Son, Cheongwon, KR;
Jeong Hwan Lee, Seoul, KR;
Assignee:
SK HYNIX INC., Icheon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/34 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 21/486 (2013.01); H01L 21/4871 (2013.01); H01L 21/56 (2013.01); H01L 23/34 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 23/42 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A multi chip package includes a protective layer having an upper surface that surrounds a first chip and a second chip, which are mounted over a first substrate, to expose an upper surface of the first chip and an upper surface of the second chip, a heat spreader disposed over the upper surfaces, and a thermal interface material disposed at an interface between the heat spreader and the upper surfaces.