The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Mar. 03, 2021
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Ho Young Son, Icheon-si Gyeonggi-do, KR;
Sung Kyu Kim, Icheon-si Gyeonggi-do, KR;
Mi Seon Lee, Icheon-si Gyeonggi-do, KR;
Assignee:
SK hynix Inc., Icheon-si Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16146 (2013.01); H01L 2225/06513 (2013.01);
Abstract
A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over the insulating layer and connected simultaneously with the pair of through electrodes, wherein a distance between the pair of through electrodes is greater than twice a thickness of the insulating layer.