Hitoshi Obata

Title: Hitoshi Obata: Innovator in Film Forming Technology

Introduction

Hitoshi Obata is a notable inventor based in Okayama, Japan. He has made significant contributions to the field of film forming technology, particularly through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of film formation on various substrates.

Latest Patents

Hitoshi Obata holds a patent for a "Film forming apparatus, film forming method and tray for substrate." The objective of this invention is to provide an apparatus suitable for forming a thick film on surfaces of substrates such as glass substrates and semiconductor wafers. The apparatus features a stock station for a substrate and a treatment station that are adjacent to each other. It includes portions for coating, film-forming, cleaning, and drying. Additionally, a tray with a concave portion for accommodating a substrate is provided, along with a transfer device that circulates the tray around the various treatment portions.

Career Highlights

Throughout his career, Hitoshi Obata has worked with prominent companies in the industry, including Tazmo Co., Ltd. and Tokyo Ohka Kogyo Co., Ltd. His experience in these organizations has contributed to his expertise in film forming technologies and has allowed him to develop innovative solutions in this field.

Collaborations

Hitoshi Obata has collaborated with notable colleagues such as Seiji Ohishi and Hiroshi Yamabe. Their combined efforts have further advanced the research and development of film forming technologies.

Conclusion

Hitoshi Obata's contributions to the field of film forming technology are significant, with his patent showcasing innovative solutions for substrate treatment. His work continues to influence advancements in the industry.