The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2006

Filed:

Dec. 03, 2002
Applicants:

Taiichiro Aoki, Kanagawa, JP;

Seiji Ohishi, Kanagawa, JP;

Hiroshi Yamabe, Okayama, JP;

Hitoshi Obata, Okayama, JP;

Inventors:

Taiichiro Aoki, Kanagawa, JP;

Seiji Ohishi, Kanagawa, JP;

Hiroshi Yamabe, Okayama, JP;

Hitoshi Obata, Okayama, JP;

Assignees:

Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;

Tazmo Co., Ltd., Okayama, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05C 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.


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