Hitoshi Kishida

Title: Hitoshi Kishida: Inventor in Wire and Semiconductor Technologies

Introduction

Hitoshi Kishida is an inventor associated with Osaka, Japan, and Sumitomo Electric Industries, Limited. His patent work includes technologies for wire-electro-discharge machining and aluminum-alloy interconnecting wires used in semiconductor devices. The supplied information lists 2 patents.

Latest Patents

Kishida’s listed patents address specialized wire materials and their performance in industrial and electronic applications.

“Wire Electrode for Electro-Discharge Machining” describes a wire electrode with a core covered by multiple coating layers. The core and coatings use different materials, and each coating is made from a metal or metal alloy containing a selected element, such as copper, tin, silver, aluminum, zinc, magnesium, titanium, chromium, or iron. The layered construction is intended for use in wire electro-discharge machining.

“Interconnecting Wire for Semiconductor Devices” concerns aluminum-alloy wire designed to improve ball formation during bonding while maintaining conductivity and corrosion resistance. The described compositions include aluminum with specified proportions of elements that have melting points below approximately 450°C, and may also include silicon, magnesium, manganese, or copper.

Career Highlights

Kishida’s listed inventions focus on the composition and construction of wires, with attention to manufacturing performance and material properties. His work connects machining applications with semiconductor-device interconnection technology.

Collaborations

The supplied information identifies Masanobu Nishio and Kazuhiro Nanjo as Kishida’s coworkers. It does not specify their roles in the listed patents.

Conclusion

Hitoshi Kishida’s patent portfolio reflects work on engineered wire materials for electro-discharge machining and semiconductor bonding, associated with Sumitomo Electric Industries, Limited.