Sumitomo Electric Industries, Limited

Hitoshi Kishida

Yoshihiro Nakai

Yasuyuki Otsuka

Kazuo Sawada

Masatada Numano

Minoru Yokota

Masanobu Nishio

Kazuhiro Nanjo

Yasuo Murayoshi

Naoyuki Ookubo

The present wire electrode for wire electro-discharge machining includes a core and a plurality of coating layers covering the outer peripheral surface of the core. The core and the plurality of coating layers are formed of different materials, and each of coating layers is made of a metal or a metal alloy including the metal selected from the group consisting of Cu, Sn, Ag, Al, Zn, Cs, Se, Te, Mg, Bi, Ti, P, In, Cr, and Fe.

Wire electrode for electro-discharge machining

An interconnecting wire of aluminum alloy for semiconductor devices which as improved ball-forming performance in the ball-bonding process, without any loss of conductivity and corrosion resistance. There is also provided an interconnecting wire for semiconductor devices which is lowered in resistance, with a minimum loss of conductivity and without any adverse effect on the bonding performance. The interconnecting wire contains about 0.1 to 45 wt % of an element having a melting point lower than about 450.degree. C., with the balance being substantially aluminum, or contains about 0.1 to 45 wt % of one more elements having a melting point lower than about 450.degree. C. and about 0.2 to 2 wt % of one or more elements selected from the group consisting of silicon, magnesium, manganese, and copper, with the balance being substantially aluminum.

Interconnecting wire for semiconductor devices

Growing community of inventors

Osaka, Japan

Hitoshi Kishida