The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 1988
Filed:
May. 22, 1986
Masanobu Nishio, Osaka, JP;
Kazuo Sawada, Osaka, JP;
Minoru Yokota, Osaka, JP;
Hitoshi Kishida, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
An interconnecting wire of aluminum alloy for semiconductor devices which as improved ball-forming performance in the ball-bonding process, without any loss of conductivity and corrosion resistance. There is also provided an interconnecting wire for semiconductor devices which is lowered in resistance, with a minimum loss of conductivity and without any adverse effect on the bonding performance. The interconnecting wire contains about 0.1 to 45 wt % of an element having a melting point lower than about 450.degree. C., with the balance being substantially aluminum, or contains about 0.1 to 45 wt % of one more elements having a melting point lower than about 450.degree. C. and about 0.2 to 2 wt % of one or more elements selected from the group consisting of silicon, magnesium, manganese, and copper, with the balance being substantially aluminum.