Location History:
- Musashimurayama, JP (1995)
- Tokyo, JP (1994 - 2022)
Company Filing History:
Years Active: 1994-2022
Title: Innovative Contributions of Hisashi Ueda in Semiconductor Technology
Introduction: Hisashi Ueda, an accomplished inventor based in Tokyo, Japan, has made significant strides in the field of semiconductor technology. With a total of six patents to his name, Ueda has focused on enhancing the efficiency and reliability of wire bonding processes, a crucial aspect of semiconductor manufacturing.
Latest Patents: Among Hisashi Ueda's notable inventions is a groundbreaking method for calibrating wire clamp devices. This invention outlines a systematic approach, which includes preparing a wire clamp device equipped with a pair of arm parts designed for clamping wires and a drive part incorporating a piezoelectric element. By detecting electrical continuity between the tips of the clamp arms, Ueda's method accurately acquires a reference voltage, enabling precise calibration of the application voltage necessary for stable wire bonding.
Additionally, Ueda's innovation extends to wire bonding apparatuses and manufacturing methods for semiconductor devices. His invention features components like a spool, clamper, torch electrode, and circuits designated for high-voltage power and non-bonding detection. This innovative configuration allows for the suppression of electric corrosion and simplifies the process of non-bonding detection, showcasing Ueda's ability to blend efficiency with simplicity in design.
Career Highlights: Hisashi Ueda has significantly impacted the semiconductor industry through his roles in prominent companies, notably Kabushiki Kaisha Shinkawa and Shinkawa Ltd. His expertise and commitment to advancing technology within these organizations have cemented his reputation as a key inventor and innovator in his field.
Collaborations: Throughout his career, Ueda has collaborated with notable colleagues, including Nobuyuki Aoyagi and Tadayuki Ueda. These partnerships have fostered an environment of innovation and continuous improvement, allowing Ueda to advance his research and inventions effectively.
Conclusion: Hisashi Ueda stands out as an influential figure in semiconductor technology, with his contributions enhancing wire bonding methodologies and apparatus designs. His innovative patents reflect a blend of technical expertise and a commitment to improving manufacturing processes, marking him as a prominent inventor in the industry.