Location History:
- Nakakubiki-gun, JP (2001 - 2002)
- Niigata, JP (2001 - 2002)
Company Filing History:
Years Active: 2001-2002
Title: Hisashi Oshima: Innovator in Semiconductor Technology
Introduction
Hisashi Oshima is a prominent inventor based in Nakakubiki-gun, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the production methods of semiconductor wafers, addressing critical challenges in the industry.
Latest Patents
Oshima's latest patents include a method for producing a semiconductor wafer that yields high flatness and back surface characteristics. This innovative method addresses issues related to the back surface of wafers produced by conventional grinding and polishing techniques. The process involves flattening both sides of the wafer through surface grinding, eliminating mechanically damaged layers via etching, and applying a single-side polishing treatment to achieve a back surface glossiness between 20-80%. Another notable patent is a surface grinding method that produces grinding striations, which can be fully removed with less polish-off than traditional methods. This technique utilizes an infeed type surface grinder with two independently rotating circular tables, enhancing the efficiency of wafer processing.
Career Highlights
Oshima is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His expertise and innovative approaches have positioned him as a key figure in advancing semiconductor manufacturing processes.
Collaborations
Some of his notable coworkers include Tadahiro Kato and Keiichi Okabe, who have collaborated with him on various projects within the semiconductor field.
Conclusion
Hisashi Oshima's contributions to semiconductor technology through his patents and innovative methods have significantly impacted the industry. His work continues to pave the way for advancements in wafer production and processing techniques.