The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Apr. 29, 1999
Keiichi Okabe, Nagano, JP;
Hisashi Oshima, Niigata, JP;
Sadayuki Okuni, Nishigo, JP;
Tadahiro Kato, Nishigo, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a surface grinding method and apparatus for achieving a thin plate work such as a semiconductor wafer with high flatness, high accuracy and certainty and the apparatus comprises: a surface grinder in which a grinding wheel support member,by which a rotary shaft,of a grinding wheel,is supported is held by a pivotal shaft portion,and a grinding wheel shaft inclination control motor,which displaces the grinding wheel support member,by activating the pivotal shaft portion,is provided; a corrective angle storage device,which stores a corrective angle of an inclination angle of a rotary shaft,of the grinding wheel,to a rotary shaft,of a wafer,; and a shaft inclination control apparatus,which sends out a signal to control the grinding wheel shaft inclination control motor,while reading a corrective angle of the corrective angle storage device,, wherein a relative inclination angle of the grinding wheel to the thin plate work, in a more concrete manner an inclination angle of the rotary shaft,of the grinding wheel,, is changed for each of grinding steps of high rate feed, low rate feed and spark-out.