Hitachinaka, Japan

Hisashi Mashiyama

This inventor holds 2 USPTO granted patents. Top assignees: Hitachi Cable, Inc., Hitachi Metals, Ltd.. Active years: 2007-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hisashi Mashiyama. Retrieved from https://idiyas.com/inventor/hisashi-mashiyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2007-2014

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2 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Hisashi Mashiyama in Semiconductor Technology**

Introduction

Hisashi Mashiyama, a notable inventor based in Hitachinaka, Japan, has made significant contributions to the field of semiconductor technology. With two patents to his name, his work focuses on improving the durability and efficiency of semiconductor wafers, essential components in electronic devices.

Latest Patents

Mashiyama's latest patents include a semiconductor wafer and a semiconductor device wafer. The innovative design of his semiconductor wafer features a disc shape with a chamfer around the circumferential edge. Additionally, he has developed an anti-cracking and chipping groove located in specific areas around the circumferential edge of the end face of the wafer. This groove is strategically designed to prevent cracking or chipping during the back grinding process.

Furthermore, Mashiyama's research extends to grinding abrasive grains and solutions used in semiconductor device fabrication. His findings indicate that the abrasive grains used in the process primarily have a roundness between 0.50 and 0.75. The abrasive he proposes contains these grains alongside at least one of an oxidizer, an oxide solution, an abrasive grain dispersion agent, and a basic compound. This combination enhances the effectiveness of the abrasive solution, which includes these grains mixed with water or a hydrophilic substance.

Career Highlights

Mashiyama has worked with esteemed companies such as Hitachi Cable, Inc. and Hitachi Metals, Ltd., where he has utilized his expertise to drive innovation in semiconductor processing technologies. His career reflects a deep commitment to advancing the standards of semiconductor production.

Collaborations

Throughout his career, Mashiyama has collaborated with distinguished professionals in the field, including Chie Yoshizawa and Satoshi Uematsu. These collaborations highlight the importance of teamwork in fostering innovation and advancing technological capabilities in semiconductors.

Conclusion

Hisashi Mashiyama's contributions to semiconductor technology exemplify how innovative thinking can lead to remarkable advancements in electronic manufacturing. Through his patents, he continues to influence the industry, setting standards for the durability and efficiency of semiconductor wafers, which are critical in modern electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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