Hitachi Metals, Ltd.

Hitachi Cable, Inc.

Hisashi Mashiyama

Takehiko Tani

Shusei Nemoto

Chie Yoshizawa

Satoshi Uematsu

A semiconductor wafer having a disc shape includes a chamfer provided around a circumferential edge of the wafer, and an anti-cracking and chipping groove provided in one or more areas around one circumference of an end face of the wafer along a circumferential direction of the end face. The anti-cracking and chipping groove is configured to prevent cracking or chipping of the end face in back grinding.

Semiconductor wafer and semiconductor device wafer

Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a grain to the perimeter of that grain. An abrasive has the abrasive grains and at least one of an oxidizer, an oxide solution, an abrasive grain dispersion agent and a basic compound. An abrasive solution has the abrasive grains and water or hydrophilic substance.

Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method

Growing community of inventors

Hitachinaka, Japan

Hisashi Mashiyama