The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2007

Filed:

Mar. 04, 2005
Applicants:

Chie Yoshizawa, Yokohama, JP;

Satoshi Uematsu, Hitachi, JP;

Hisashi Mashiyama, Hitachinaka, JP;

Takehiko Tani, Hitachi, JP;

Inventors:

Chie Yoshizawa, Yokohama, JP;

Satoshi Uematsu, Hitachi, JP;

Hisashi Mashiyama, Hitachinaka, JP;

Takehiko Tani, Hitachi, JP;

Assignee:

Hitachi Cable, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a grain to the perimeter of that grain. An abrasive has the abrasive grains and at least one of an oxidizer, an oxide solution, an abrasive grain dispersion agent and a basic compound. An abrasive solution has the abrasive grains and water or hydrophilic substance.


Find Patent Forward Citations

Yoshizawa, Chie. (2007). Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method (U.S. Patent No. 7267604). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7267604

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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